
Technical Packaging Award
『Pouch with Three-dimensional molding “Cool Shock®”』
Toyo Seikan Co., Ltd.
We have developed a proprietary technology called Cool Shock® molding to create a three-dimensional form simply by compressing from one side of a film with a convex mold. By applying this molding to the pouch, it became possible to express in three dimensions designs, which were previously limited to two-dimensions by printing, and impart excellent design properties to the pouch.