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Technical Packaging Award

『Pouch with Three-dimensional molding “Cool Shock®”』

『Pouch with Three-dimensional molding “Cool Shock®”』

Toyo Seikan Co., Ltd.

We have developed a proprietary technology called Cool Shock® molding to create a three-dimensional form simply by compressing from one side of a film with a convex mold. By applying this molding to the pouch, it became possible to express in three dimensions designs, which were previously limited to two-dimensions by printing, and impart excellent design properties to the pouch.

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