good_packaging
Package Design Award

『Sony Future Lab Program N Package』

『Sony Future Lab Program N Package』

Sony Global Manufacturing & Operations Corporation
Sony Corporation Creative Center
Sony Corporation, R&D Platform
TSUJITOMI & Co, Ltd.
NIHON HOUZAI CO., LTD.
PHOENIX ENGINEERING CORP.

In order to implement a light texture package expressing wearable, needle punch felt material of fiber accumulation is applied. This is a new package method applying laminated structure to create felt feeling.

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