Package Design Award
『Sony Future Lab Program N Package』
Sony Global Manufacturing & Operations Corporation
Sony Corporation Creative Center
Sony Corporation, R&D Platform
TSUJITOMI & Co, Ltd.
NIHON HOUZAI CO., LTD.
PHOENIX ENGINEERING CORP.
In order to implement a light texture package expressing wearable, needle punch felt material of fiber accumulation is applied. This is a new package method applying laminated structure to create felt feeling.